Critically aligned optical MEMS dies for large packaged substrate arrays and method of manufacture
US6531767B2 · kind B2 · utility
48Cited by
3References
22Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 9, 2001 |
| Grant date | Mar 11, 2003 |
| Priority date | — |
| Expiry date | Apr 9, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A novel array of optically and electrically interacting optical MEMS dies physically and electrically integrally attached upon an optically transmissive preferably (transparent) printed circuit substrate that is monolithically formed with one or more optical components, such as lenses, for providing fixed optical path alignment and interaction therebetween, and with provision for the integration also of active optical components such as lasers and photodiodes and the like.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.