Method and apparatus for securing an electronic component
US6532746B1 · kind B1 · utility
5Cited by
5References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 24, 2002 |
| Grant date | Mar 18, 2003 |
| Priority date | — |
| Expiry date | Jan 24, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A securing apparatus is used to secure an electronic component, such as a thermoelectric cooler in a thermoelectric cooling system. The securing apparatus includes a clamping mechanism that clamps the electronic component between a first plate, such as a heat sink plate, and a second plate, such as a mounting plate. The clamping mechanism applies compression forces to the electronic component to secure the electronic component without using shear forces capable of damaging the electronic component. The clamping mechanism preferably provides thermal isolation between the heat sink plate and the mounting plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.