Patent · US Expired

Compound dip process for metal cans

US6533517B1 · kind B1 · utility

1Cited by

6References

3Claims

0Family size

Assignee

Schmalbach-Lubeca AG · DE

Inventors

Reinhard Kutschan · Salzgitter, DE
Hellmut Bunsch · Hamburg, DE

Key dates

Filing date	Oct 10, 2000
Grant date	Mar 18, 2003
Priority date	—
Expiry date	Oct 10, 2020

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB65D7/36
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

Sealant is applied onto or into a folded-seam closure of a metal can. Instead of introducing sealant into the U-shaped lid flange and drying, according to the invention the compound or sealant is applied to the base flange, the base of the metal can being dipped into a current of fluid sealant or at least brought into contact with it at the surface. This substantially improves the precision of dosing and the exact amount of applied sealant.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.