Mold clamping apparatus for injection molding machine
US6533573B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 18, 2001 |
| Grant date | Mar 18, 2003 |
| Priority date | — |
| Expiry date | Jul 18, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2045/688
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A mold clamping apparatus for an injection molding machine includes a stationary platen fixedly holding the stationary mold, a movable platen fixedly holding the movable mold and disposed opposite to the stationary platen, tie bars for guiding the movable platen for movement toward and away from the stationary platen, a movable platen driving mechanism for moving the movable platen along the tie bars to close and open the mold, a movable platen fixing mechanism for fixing the movable platen to the tie bars at a set position immediately before a position where the movable mold is joined to the stationary mold, and a clamping force applying mechanism including sealed hydraulic cylinder actuators capable of converting energy of a hydraulic fluid into an intensified mold clamping force and of applying the intensified mold clamping force to the stationary platens. In one embodiment, a rear plate located behind the movable platen carries a hydraulically driven ram support and clamping ram, and the ram support has a piston portion that is carried in a cylinder bore in the rear plate. The ram hydraulically clamps the mold closed after the movable platen is electrically driven to bring the …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.