Ball grid array connector having improved contact configuration
US6533590B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 17, 2001 |
| Grant date | Mar 18, 2003 |
| Priority date | — |
| Expiry date | Dec 17, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R4/027
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electrical socket for electrically connecting with a pin of a IC package. A contact secured in the socket comprises first and second claw portions formed on opposite ends thereof and two spring arms between the first and second claw portions for being engaged with the IC package pin. The first and second claw portions have two claw feet, respectively. The four claw feet define a clip section in which a solder ball can be received and kept in a predetermined plane when the solder ball is pressed towards the contact. The claw feet can grip the solder ball firmly to avoid the falling of the solder ball during assembling and soldering procedure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.