Deposition apparatus
US6533868B1 · kind B1 · utility
5Cited by
10References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 11, 2000 |
| Grant date | Mar 18, 2003 |
| Priority date | — |
| Expiry date | May 11, 2020 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/564
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
This invention relates to an apparatus for depositing a layer of material on to a workpiece. The apparatus includes chamber 11, a sputter target 12, a wafer support 13, wafer transport aperture 14 and a wafer transport mechanism 15. The last delivers the wafers along a transport path 16. An annular shield 19 is disposed between the support 13 and the target 12 and lies in the wafer transport path 16. Pins 30 are provided to lift the annular shield out of the transport path 16.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.