Method and system for extrusion embossing
US6533884B1 · kind B1 · utility
43Cited by
48References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 3, 2000 |
| Grant date | Mar 18, 2003 |
| Priority date | — |
| Expiry date | Feb 2, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1023
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention provides a novel method and system for extrusion embossing. In particular, the present invention provides a method and system for embossing a multi-layer flexible packaging material whereby one layer is embossed simultaneously with the extrusion of an adjacent layer and the lamination of an additional layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.