Microelectromechanical mirror and mirror array
US6533947B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2001 |
| Grant date | Mar 18, 2003 |
| Priority date | — |
| Expiry date | Sep 20, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B3/0062
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
Method for manufacturing microelectromechanical mirror and mirror array. Control electrodes and addressing circuitry are etched from a metallic layer deposited onto a reference layer substrate. Standoff-posts are etched from a subsequently deposited polyimide layer. A freely movable plate flexibly suspended from a plurality of electrostatic actuators that are flexibly suspended from a support frame is etched from an actuation layer substrate using a high aspect ratio etch. A mirror support post and surface are etched from a mirror substrate using a high aspect ratio etch. The mirror and actuation layer substrates are fusion bonded together. The reference and actuation layer substrates are bonded together and held apart by the standoff posts. A reflective metallic layer is deposited onto the mirror surface and polished. The mirror is etched from the mirror surface to free the microelectromechanical mirror. Mirror arrays are made by performing the aforementioned steps using standard IC processing techniques.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.