Method for treating carbon film, carbon film and component with carbon film
US6534131B1 · kind B1 · utility
12Cited by
4References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 14, 2001 |
| Grant date | Mar 18, 2003 |
| Priority date | — |
| Expiry date | Feb 14, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/30
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for treating a carbon film comprising, in sequence, depositing a carbon film onto a substrate by a plasma CVD technique and exposing the carbon film at its surface to a gas plasma produced utilizing at least one type of gas selected from an Ar gas, N2 gas, H2 gas and F-containing gas so that the carbon film surface is modified.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.