Multi-purpose finish for printed wiring boards and method of manufacture of such boards
US6534192B1 · kind B1 · utility
44Cited by
9References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 24, 1999 |
| Grant date | Mar 18, 2003 |
| Priority date | — |
| Expiry date | Sep 24, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/1291
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed wiring board (PWB) and a method of manufacturing the same. In one embodiment, the PWB includes: (1) a substrate having a conductive trace located thereon and (2) a multi-purpose finish including palladium alloy where palladium is alloyed with cobalt or a platinum group metal and is located on at least a portion of the conductive trace, which forms both a non-contact finish and a contact finish for the PWB.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.