Connection structure for metallic members and connecting method therefor
US6534195B1 · kind B1 · utility
4Cited by
1References
16Claims
0Family size
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Key dates
| Filing date | Jun 11, 2001 |
| Grant date | Mar 18, 2003 |
| Priority date | — |
| Expiry date | Jun 11, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12792
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Sn—Zn alloy is plated on at least one of a first metallic member and a second metallic member, Sn—Ag alloy is used as a solder, the first metallic member and the second metallic member are connected by the solder, and a connection structure of metallic members is therefore produced. Heat degradation of plating and the contact corrosion between solder and plating can thereby be prevented, solderability can be improved, and qualities such as corrosion resistance and connecting strength at the connection structure can be improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.