Mask design and method for controlled profile fabrication
US6534425B1 · kind B1 · utility
15Cited by
11References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 20, 2000 |
| Grant date | Mar 18, 2003 |
| Priority date | — |
| Expiry date | Apr 4, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/949
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A photolithography reticle for use in conjunction with an exposure tool to produce a tapered sidewall profile in photoresist includes a solid portion and multiple sub-resolution line portions. The solid portion has a width which is greater than a resolution of the exposure tool. The sub-resolution line portions have widths which are less than the resolution of the exposure tool. Each of the sub-resolution line portions is spaced apart from the solid portion and from the others of the plurality of sub-resolution line portions by less than the resolution of the exposure tool.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.