Resin materials and films made therefrom
US6534580B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 5, 1999 |
| Grant date | Mar 18, 2003 |
| Priority date | — |
| Expiry date | Nov 5, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L29/04
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A resin material comprising a resin, which satisfies at least one relationship selected from the group consisting of the following relationships [I] and [II] is provided:ln(OTR/22.5)+4.78 ln(Fy/Fy′)<−0.13, and T2−T1≦20  [I]in which Fy′ is a yield strength of a standard saponified ethylene-vinyl acetate copolymer at 60° C.; Fy is a yield strength of the resin material at 60° C.; OTR is an oxygen gas permeability (cc/m2·day·atm) of the resin material per a unit thickness of 1 &mgr;m at 23° C. and a relative humidity of 0%; T1 is a haze (%) of a film of the resin material having a thickness of 30 &mgr;m after being maintained at 23° C. and a relative humidity of 48% for 48 hours; and T2 is a haze (%) of a film of the resin material having a thickness of 30 &mgr;m after being maintained at 40° C. and a relative humidity of 90% for 24 hour, andln(OTR/22.5)+0.0698(Tim−157)<−0.06 [II]in which OTR is an oxygen gas permeability (cc/m2·day·atm) of the resin material per a unit thickness of 1 &mgr;mat 23° C. and a relative humidity of 0%; and Tim is a melting point of the resin material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.