Resistor trimming with small uniform spot from solid-state UV laser
US6534743B2 · kind B2 · utility
27Cited by
10References
50Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 31, 2002 |
| Grant date | Mar 18, 2003 |
| Priority date | — |
| Expiry date | Jan 31, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01C17/242
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A uniform laser spot, such as from an imaged shaped Gaussian output (118) or a clipped Gaussian spot, that is less than 20 &mgr;m in diameter can be employed for both thin and thick film resistor trimming to substantially reduce microcracking. These spots can be generated in an ablative, nonthermal, UV laser wavelength to reduce the HAZ and/or shift in TCR.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.