Semiconductor device
US6534845B1 · kind B1 · utility
3Cited by
7References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 9, 1999 |
| Grant date | Mar 18, 2003 |
| Priority date | — |
| Expiry date | Jun 9, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor. device comprises a semiconductor chip on which a plurality of grooves are defined, thus acting as a resisting member, the effect of which is to prevent the semiconductor chip from bending. Consequently, the thickness of the lower portion of the plastic layer becomes greater, thereby preventing cracks from occurring on the semiconductor chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.