Optimizing the power connection between chip and circuit board for a power switch

US6534878B1 · kind B1 · utility

Assignee

• Siemens Aktiengesellschaft · DE

Inventors

• Rainald Sander · Oberhaching, DE
• Chihao Xu · Riegelsberg, DE

Key dates

• Filing date: Jul 8, 1998
• Grant date: Mar 18, 2003
• Expiry date: Dec 26, 2019

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/3011
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

For optimizing the power connection between semiconductor chip and conductor frame in a semiconductor switch, the bond wires that form the power path input of the power part are symmetrically bonded on the conductor frame. The length of the bond wires is then the same and shorter than in an asymmetrical connection since bonding is carried out from two sides.