Semiconductor chip and semiconductor device having the chip
US6534879B2 · kind B2 · utility
23Cited by
4References
36Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 22, 2001 |
| Grant date | Mar 18, 2003 |
| Priority date | — |
| Expiry date | Apr 26, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor chip includes a main surface having a plurality of sides, a plurality of signal electrodes formed on the main surface along the sides, the signal electrodes along one of the sides being disposed in a first area having a first length. The chip further includes a power supply electrode formed on the main surface along the sides, the power supply electrode along the one of the sides being disposed in a second area having the second length, which is longer than the first length, between the one of sides and the signal electrodes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.