Surface acoustic wave device and method of manufacture thereof
US6534901B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 21, 2001 |
| Grant date | Mar 18, 2003 |
| Priority date | — |
| Expiry date | Nov 21, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49798
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A SAW element (13) is formed of a piezoelectric substrate (14), on which are provided IDT electrodes (15), connection electrodes (16), underlying metal layers (17), and acoustic materials (18) placed on the underlying metal layers (17) and having surfaces parallel to the main surface of the piezoelectric substrate (14). The SAW element is mounted in a package (10), which is provided with external terminals (11) connected with the connection electrodes (16), and the package is hermetically sealed with a lid (20) to form a SAW device. When such a SAW element (13) is mounted faceup in a package (10) using a vacuum chuck (30), its piezoelectric substrate (14) can be protected against damage. When a SAW element (13) provided with bumps (23) on its connection electrodes (16) is mounted facedown in a package (10), the failure of electrical connections can be prevented.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.