Systems and methods for obtaining an electrical characteristics of a circuit board assembly process
US6535005B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 26, 2000 |
| Grant date | Mar 18, 2003 |
| Priority date | — |
| Expiry date | Apr 26, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/112
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention is directed to techniques for obtaining an electrical characteristic of a circuit board assembly process which involves mounting a module to an installation location of a circuit board using the circuit board assembly process, and measuring leakage current of the test structure in response to an electrical signal (e.g., a voltage) applied to the installation location. One can then determine the surface insulation resistance (SIR) of the test structure based on the electrical signal and the leakage current in order to assess the suitability of the circuit board assembly process. One arrangement of the invention is directed to a system for obtaining an electrical characteristic of a circuit board assembly process. The system includes a test structure having (i) a circuit board having a module installation location and an interface location in electrical communication with the module installation location, and (ii) a module which is mounted to the circuit board at the module installation location using the circuit board assembly process. The system further includes a signal generator that couples to the interface location of the circuit board, and that applies an…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.