Heat transfer apparatus

US6535387B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Mark D. Summers · Phoenix, US
• Karl H. Mauritz · Eagle, US
• Amber S. Bedi · Phoenix, US
• William Handley · Chandler, US
• Carol Miller · Mesa, US
• Javier Leija · Chandler, US
• Daniel Dragoon · Fairfield, US

Key dates

• Filing date: Jun 28, 2001
• Grant date: Mar 18, 2003
• Expiry date: Jun 28, 2021

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Audio-visual technology
• WIPO sector: Electrical engineering

Abstract

The present invention relates generally to apparatus and methods for the spreading and dissipation of thermal energy from heat-producing components. More particularly, it relates to a heat transfer apparatus and methods particularly useful in the electrical arts. One embodiment of a heat transfer apparatus include but not limited to, a spring-biased member comprising a first side member, a second side member, and a connecting member adapted for spring-biased removable attachment to a heat-producing device. Another embodiment of a heat transfer apparatus is a spring-biased carrier that attaches to a heat-producing device and which carries a member, such as a finned plate. Another embodiment of a heat transfer apparatus is a spring-biased member comprising fingers for conducting thermal energy to a structure. Another embodiment of a heat transfer apparatus is a spring-biased clip used to attach separate heat-spreading/dissipating members, such as a finned plate, against a heat-producing member.