Mounting substrate and heat sink for high-power diode laser bars
US6535533B2 · kind B2 · utility
26Cited by
7References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 2, 2001 |
| Grant date | Mar 18, 2003 |
| Priority date | — |
| Expiry date | Aug 22, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/02484
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Mounting substrate and heat sink for high-power diode laser bars, the mounting substrate permitting mounting of the high-power diode laser bars by hard-soldering on the basis of a matching expansion to the semiconductor material. The mounting substrate is difficult to bend and of extremely high thermal conductivity, and can be used universally for the various cooling elements of conductive and convective cooling mechanisms.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.