Patent · US Expired

Mounting substrate and heat sink for high-power diode laser bars

US6535533B2 · kind B2 · utility

26Cited by
7References
11Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 2, 2001
Grant dateMar 18, 2003
Priority date
Expiry dateAug 22, 2021

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01S5/02484
  • WIPO fieldOptics
  • WIPO sectorInstruments

Abstract

Mounting substrate and heat sink for high-power diode laser bars, the mounting substrate permitting mounting of the high-power diode laser bars by hard-soldering on the basis of a matching expansion to the semiconductor material. The mounting substrate is difficult to bend and of extremely high thermal conductivity, and can be used universally for the various cooling elements of conductive and convective cooling mechanisms.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.