Adhesive sealed organic optoelectronic structures
US6537688B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 1, 2000 |
| Grant date | Mar 25, 2003 |
| Priority date | — |
| Expiry date | Dec 1, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/239
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An organic optoelectronic device structure is provided. The organic optoelectronic device structure comprises: (a) a polymer substrate layer; (a) a first barrier region disposed over a first face of the polymer substrate layer; (c) an organic optoelectronic device disposed over a second face of the polymer substrate layer opposite the first face; (d) a second barrier region disposed over the second face of the polymer substrate layer and over the organic optoelectronic device; and (e) an adhesive region. The adhesive region is disposed between the polymer substrate layer and the second barrier region such that it bonds the polymer substrate layer to the second barrier region. Moreover, the adhesive region encircles the organic optoelectronic device such that the organic optoelectronic device is completely surrounded by the adhesive region, the polymer substrate layer and second barrier region. In some embodiments, the organic optoelectronic device structure is further provided with a third barrier region, which is disposed at least on the edges of the polymer substrate layer. Organic optoelectronic devices, including circuits, appropriate for the practice of the present invention i…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.