Pattern-forming methods and radiation sensitive materials
US6537735B1 · kind B1 · utility
9Cited by
14References
37Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 5, 2000 |
| Grant date | Mar 25, 2003 |
| Priority date | — |
| Expiry date | Jan 5, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/0082
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The invention is directed to a method for producing a predetermined resist pattern on a substrate. The method includes the patternwise application of infrared radiation to a precursor which contains the substrate, having a coating thereon, wherein the coating contains a positive working composition; and the development of the pattern using a developer. The composition contains a polymeric substance having functional groups Q thereon, such that the functionalized polymeric substance has the property that it is developer insoluble prior to delivery of infrared radiation and developer soluble thereafter.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.