Method of manufacturing semiconductor device and apparatus of automatically adjusting semiconductor pattern
US6537835B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 23, 2001 |
| Grant date | Mar 25, 2003 |
| Priority date | — |
| Expiry date | Oct 23, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/947
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method of manufacturing a semiconductor device and an apparatus of automatically adjusting a semiconductor pattern can precisely correct a difference in the shape or position of a pattern exposed or formed in two exposure steps. A pattern measuring unit measures an offset between the first pattern and the second pattern in a pattern measuring step. Based on the information on the offset thus detected, the first pattern is adjusted in a first patterning step with a high degree of freedom in the next manufacturing step cycle of a semiconductor device to precisely align the shape or position of the first pattern with the second pattern in a second patterning step with a low degree of freedom.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.