Substrate for mounting semiconductor element having circuit patterns, and an insulating layer made of photosensitive and thermally-melting type adhesive resin
US6538209B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 16, 1999 |
| Grant date | Mar 25, 2003 |
| Priority date | — |
| Expiry date | Sep 16, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Circuit patterns are formed on the one surface of an insulating substrate, and an insulating layer is formed to cover the circuit patterns. The insulating layer is made of a photosensitive and thermally-melting type adhesive resin. In the insulating layer, through-holes are made by exposure/development processing to form conductive paths for contacts and contact portions. On the other surface of the insulating substrate, a conductive layer is formed and openings each passing through the conductive layer and insulating substrate are formed. Thus, a mounting substrate can be obtained which has a structure in which first circuit patterns each is exposed in each of the openings. A chip is mounted on the mounting substrate thus formed and heated. The insulating layer serves as an adhesive to seal the active face of the chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.