Multi-layer circuits and methods of manufacture thereof
US6538211B2 · kind B2 · utility
40Cited by
49References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 13, 2001 |
| Grant date | Mar 25, 2003 |
| Priority date | — |
| Expiry date | Dec 13, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2495
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multi-layer circuit comprises a circuit and a resin covered conductive layer disposed on the circuit, wherein the resin covered conductive layer comprises a liquid crystalline polymer resin laminated to a conductive layer. Such multi-layer circuits are particularly useful for high density circuit applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.