Method and apparatus for improving laser hole resolution
US6538230B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 17, 2001 |
| Grant date | Mar 25, 2003 |
| Priority date | — |
| Expiry date | May 17, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/0097
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A high resolution, high speed laser drilling system for operating on an advancing product operates to advances the product in a predetermined product advancement path at a product advancement speed. A laser-generating source provides a pulsed laser beam having a laser-on time and a laser-off time. The laser beam is reflected to direct a focal point of the laser beam onto the advancing product. The focal point of the laser beam is moved in a direction of the product advancement path during the laser-on time and is moved in a direction opposite to the direction of the product advancement path during the laser-off time. The system is therefore able to improve laser drilling resolution for a given product advancement speed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.