Semiconductor device
US6538319B2 · kind B2 · utility
53Cited by
9References
22Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 7, 2001 |
| Grant date | Mar 25, 2003 |
| Priority date | — |
| Expiry date | Feb 7, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device including a substrate having a surface on which interconnections are formed, a semiconductor element connected to the interconnections and mounted on the substrate, and a conductive cap for covering the semiconductor element electrically connected to a ground potential. The emission of an electromagnetic wave from the semiconductor element externally of the semiconductor device and malfunctioning of the semiconductor element due to an external electromagnetic wave incident thereon, can be prevented by the conductive cap.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.