Method and apparatus for thermally insulated and earth cooled electronic components within an electronic system
US6538883B1 · kind B1 · utility
10Cited by
3References
38Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 19, 2001 |
| Grant date | Mar 25, 2003 |
| Priority date | — |
| Expiry date | Sep 19, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20609
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic system is described having electronic components and an air flow channel that directs cooled air across the electronic components and directs warmed air into a heat exchanger. The electronic components and air flow channel are within a thermal insulating barrier. The heat exchanger converts the warmed air into the cooled air. The heat exchanger has an interface that couples to a ground loop that accepts warmed fluid from the heat exchanger and provides cooled fluid to the heat exchanger when the ground loop is at least partially located within the earth.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.