Method and apparatus for removing heat from a component
US6538884B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 21, 2001 |
| Grant date | Mar 25, 2003 |
| Priority date | — |
| Expiry date | Sep 21, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for removing heat (118) from a component (102) located on a surface (104) of an electronics module (100). The apparatus includes a heat removal device (108) mounted to electronics module (100) a radial distance (110) away from component (102) and a heat conductor (112) having a first portion (115) coupled to component (102) and a second portion (117) coupled to heat removal device (108). A method for removing heat (118) from a component (102) on a surface (104) of an electronics module (100) includes generating heat (118), conveying the heat from the component (102) by way of a heat conductor (112) and depositing the heat (118) to a heat removal device mounted to the electronics module (100)
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.