Heat dissipation device retention assembly
US6538889B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 16, 2001 |
| Grant date | Mar 25, 2003 |
| Priority date | — |
| Expiry date | Oct 16, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/4871
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method and apparatus to encourage correct operator assembly and disassembly of a component in a socket, and the component has a heat dissipation device attached to a substrate. A first embodiment of the invention involves a method to assemble a component and a heat dissipation device to a socket on a substrate using a retention assembly. A second embodiment of the invention involves a method to disassemble a component and a heat dissipation device from a socket on a substrate using a retention assembly. A third embodiment of the invention involves an assembled substrate with a retention assembly to limit operator ability to open and close a socket holding a component, relative to the engagement and disengagement of the retention assembly attached to the component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.