Ball grid array tool
US6539618B1 · kind B1 · utility
15Cited by
14References
3Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 26, 2000 |
| Grant date | Apr 1, 2003 |
| Priority date | — |
| Expiry date | May 26, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53274
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A tool for removing ball grid array (BGA) packaged integrated circuit or multi-chip modules from printed circuit boards is comprised of a two-tined fork with a heated wire stretched between the tips of the tines and a thin sheet of material filling the area between the tines.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.