Adhesive transfer device
US6539997B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 6, 2001 |
| Grant date | Apr 1, 2003 |
| Priority date | — |
| Expiry date | Mar 6, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1741
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention provides an adhesive transfer device comprising a frame and first and second cooperating structures each having a substrate engaging surface, the first cooperating structure being a nip roller rotatably mounted to the frame. The selected substrate and the adhesive carrying substrate can be advanced between the cooperating structures with the substrate engaging surfaces thereof cooperating to apply pressure to the substrates. This causes the first portion of the pressure-sensitive adhesive layer to adhere to the selected substrate and the second portion of the pressure-sensitive adhesive layer to adhere to a pick-up portion of the substrate engaging surface of the nip roller. The pick-up portion of the substrate engaging surface of the nip roller has a greater affinity for adhesive bonding than the surface of the adhesive carrying substrate on which the layer is coated so that as the substrates are discharged from between the cooperating structures, the second portion of the adhesive layer remains adhered to the pick-up portion of the nip roller rather than to the adhesive carrying substrate. An adhesive pick-up device has an adhesive pick-up surface with a gre…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.