Protective cover tape having a foam layer
US6540086B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 13, 2000 |
| Grant date | Apr 1, 2003 |
| Priority date | — |
| Expiry date | Oct 13, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/233
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Apparatus and methods are presented herein for protecting electronic components from damage during transport or “drop testing.” A packaging system of the present invention includes a novel cover tape bonded to a carrier tape, which cover tape includes a foam layer attached thereto on its underside. The foam layer prevents excessive movement of the electronic components within the cavities, thereby protecting the leads and other parts of the components from damage. The method for protecting the components in the cavities of the carrier tape includes attaching the foam layer on the underside of the cover tape before sealing the cover tape on the carrier tape. When the cover tape is bonded to the carrier tape with the components placed in the cavities, the foam layer prevents excessive movement of the components therein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.