Three-dimensional flexible adhesive film structures

US6541098B2 · kind B2 · utility

Assignee

• Avery Dennison Corporation · US

Inventors

• Sriram Venkatasanthanam · Pasadena, US
• Evgueni Rozenbaoum · Altadena, US
• Pradeep Iyer · La Puente, US
• Jesse C. Ercillo · Covina, US
• John F. Hughen · Rancho Cucamonga, US
• Michael Hannington · London, US
• Prakash Mallya · Sierra Madre, US

Key dates

• Filing date: Dec 22, 2000
• Grant date: Apr 1, 2003
• Expiry date: Feb 4, 2021

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/2848
• WIPO field: Other special machines
• WIPO sector: Mechanical engineering

Abstract

Three-dimensional flexible adhesive film structures are described which exhibit tack on demand characteristics. The film is capable of showing minimal or no tack under normal handling conditions, but when pressed against a target surface, exhibits the desired adhesion.