Nanoporous silicone resins having low dielectric constants

US6541107B1 · kind B1 · utility

Assignee

• Dow Corning Corporation · US

Inventors

• Bianxiao Zhong · Midland, US
• Russell Keith King · Midland, US
• Kyuha Chung · Midland, US
• Shizhong Zhang · Jilin, CN

Key dates

• Filing date: Oct 25, 1999
• Grant date: Apr 1, 2003
• Expiry date: Oct 25, 2019

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/24999
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

Nanoporous silicone resins and silicone resin films having low dielectric constants and a method for preparing such nanoporous silicone resins. The silicone resin comprises the reaction product of a mixture comprising(A) 15-70 mol % of a tetraalkoxysilane described by formulaSi(OR1)4, where each R1 is an independently selected alkyl group comprising 1 to about 6 carbon atoms,(B) 12 to 60 mol % of a hydrosilane described by formulaHSiX3, where each X is an independently selected hydrolyzable substituent,(C) 15 to 70 mole percent of an organotrialkoxysilane described by formulaR2Si(OR3)3, where R2 is a hydrocarbon group comprising about 8 to 24 carbon atoms or a substituted hydrocarbon group comprising a hydrocarbon chain having about 8 to 24 carbon atoms and each R3 is an independently selected alkyl group comprising 1 to about 6 carbon atoms; in the presence of(D) water,(E) hydrolysis catalyst, and(F) organic solvent for the reaction product.The silicone resin is cured and heated in an inert atmosphere at a temperature sufficient to effect thermolysis of carbon-carbon bonds of the R2 groups thereby forming a nanoporous silicone resin.