Positive acting photoresist composition and imageable element
US6541181B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 26, 2000 |
| Grant date | Apr 1, 2003 |
| Priority date | — |
| Expiry date | Jul 26, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/145
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A positive acting, composition that can be heat-sensitive is presented, either coated on a lithographic base, or on a printing circuit board base, and comprises a water soluble heat-sensitive resin, a novel adhesion promoter and a radiation absorbing agent—a dye or a pigment. An excellent film forming polymer that comprises acetal units directly pendant from the polymer polyvinyl alcohol backbone may be the only binder resin, when other resins being optional. The solubility of the coated material in the areas exposed to near -IR laser radiation in mild alkaline developers becomes considerably higher, allowing to obtain high resolved patterns of the etch-resistant material on printing circuit boards or lithographic printing plates. The composition can be applied on the substrate from a liquid of laminated as a dry film. Sensitizers may be added to render the composition sensitive to radiation in a non-thermal sense.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.