Semiconductor device including stud bumps as external connection terminals
US6541848B2 · kind B2 · utility
29Cited by
14References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 13, 1998 |
| Grant date | Apr 1, 2003 |
| Priority date | — |
| Expiry date | Oct 13, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a semiconductor chip, a resin package for sealing said semiconductor chip, metal layers provided on a mounting-side surface of said resin package in an exposed manner and connecting members for electrically connecting electrode pads provided on the semiconductor chip and the metal layers. The metal layers are provided with stud bumps on the mounting side, the stud bumps serving as external connection terminals.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.