Porous dielectric material and electronic devices fabricated therewith
US6541865B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 26, 2001 |
| Grant date | Apr 1, 2003 |
| Priority date | — |
| Expiry date | Jun 26, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/249953
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A novel dielectric composition is provided that is useful in the manufacture of electronic devices such as integrated circuit devices and integrated circuit packaging devices. The dielectric composition is prepared by crosslinking a thermally decomposable porogen to a host polymer via a coupling agent, followed by heating to a temperature suitable to decompose the porogen. The porous materials that result have dielectric constants less than about 3.0, with some materials having dielectric constants less than about 2.5. Integrated circuit devices, integrated circuit packaging devices, and methods of manufacture are provided as well.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.