Modular high power solid state amplifier
US6542035B2 · kind B2 · utility
13Cited by
5References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 28, 2000 |
| Grant date | Apr 1, 2003 |
| Priority date | — |
| Expiry date | May 9, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03F3/602
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A modular high power solid state amplifier and method of assembly, manufacture and use are herein disclosed. The high power amplifier includes a number of amplifiers, a DC board having flexible interconnects, a RF cover including an interlocking RF input, a RF board, a chassis, and a top cover; thereby providing an encased stand-alone solid state amplifier. The solid state components, angled designs, and piggyback topology of the invention provide a compact, efficient, integrated high power amplifier device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.