Systems for mounting electronic component modules
US6542383B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 3, 2001 |
| Grant date | Apr 1, 2003 |
| Priority date | — |
| Expiry date | Oct 3, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K9/0016
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Systems for mounting electronic components are provided. An exemplary system includes a module that is configured to mount to a chassis at a first pitch. The module incorporates a housing, which is adapted to at least partially encase an electronic component, and spring fingers that are arranged at least partially about an exterior of the housing. The spring fingers are configured to deflect in response to a displacement force so that the module can be mounted to a chassis. The module can be mounted to a first chassis that accommodates a predetermined pitch of modules. In some embodiments, the module also can be mounted at a different pitch. Other systems also are provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.