Characterization of microelectromechanical structures
US6542829B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 21, 2000 |
| Grant date | Apr 1, 2003 |
| Priority date | — |
| Expiry date | Feb 22, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H3/0072
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
Accurate characterization of microelectromechanical systems (MEMS) geometry is critical for device design and simulation, for material property extraction, and for post-fabrication trimming. According to the present embodiment, a method for characterizing parameters describing MEMS structures resulting from the fabrication process or process variations is presented. According to the prefered embodiment, experimentally obtained natural frequencies are compared with numerical simulations to identify unknown values of structural parameters or parameter variations. Further, the prefered embodiment teaches how electrostatically-driven laterally resonant comb-drive MEMS test structures with prescribed changes in spring width are used to characterize systematic variations in process offsets and sidewall angles. The disclosed technique is both in-situ and non-destructive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.