Manufacturing system using solder self-alignment with optical component deformation fine alignment
US6543114B2 · kind B2 · utility
6Cited by
11References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 8, 2001 |
| Grant date | Apr 8, 2003 |
| Priority date | — |
| Expiry date | Aug 3, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A process for assembling micro-optical systems, such as optoelectronic and/or fiber optic components uses solder self-alignment to achieve a coarse, passive alignment of optical components relative to the optical bench. The fine, final alignment is performed using plastic deformation of the optical components to thereby improve the alignment of the optical components. As a result, the sub-micrometer alignment accuracies are attainable, if required.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.