Patent · US Expired

Process and device for joining by punching and riveting

US6543115B1 · kind B1 · utility

21Cited by

6References

59Claims

0Family size

Assignee

NEWFREY LLC · US

Inventors

Dieter Mauer · Lollar, DE
Reinhold Opper · Reiskirchen, DE
Joachim Möser · Ulrichstein, DE
Dirk Hermann · Dillenburg, DE

Key dates

Filing date	Aug 15, 2000
Grant date	Apr 8, 2003
Priority date	—
Expiry date	Aug 15, 2020

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/5343
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A method as well as an apparatus manufactures a punch riveted joint, wherein at least two layers are pressed by a holding-down device against the die and a rivet, in particular a semitubular rivet, is provided for joining the layers. The holding-down device is connected by a coupling unit to the punch in such a way that during a punch riveting operation a coupling of the holding-down device to the punch may be varied between a substantially rigid coupling state and an uncoupled state.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.