Patent · US Expired

Device for simultaneously separating a multiplicity of wafers from a workpiece

US6543434B2 · kind B2 · utility

8Cited by

5References

14Claims

0Family size

Assignee

Wacker Chemie AG · DE

Inventors

Bernhard Holzmüller · Burgau, DE
Ulrich Wiese · Burghausen, DE
Jochen Greim · Kempten (Allgäu), DE

Key dates

Filing date	Dec 5, 2000
Grant date	Apr 8, 2003
Priority date	—
Expiry date	Jan 25, 2021

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB28D5/042
WIPO fieldOther special machines
WIPO sectorMechanical engineering

Abstract

A device for simultaneously separating a multiplicity of wafers from a hard brittle workpiece having a longitudinal axis, with a wire web made from saw wire and with an advancing device which brings about a translational relative movement, which is perpendicular to the longitudinal axis of the workpiece, between the workpiece and the wire web of the wire saw, in the course of which movement the workpiece is passed through the wire web, wherein the wire web is formed from a multiplicity of individual wires, and wherein there is a device for holding and rotating the workpiece about the longitudinal axis.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.