Cold-plasma treatment of seeds to remove surface materials
US6543460B1 · kind B1 · utility
23Cited by
12References
34Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 23, 2000 |
| Grant date | Apr 8, 2003 |
| Priority date | — |
| Expiry date | Jun 23, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB08B7/0035
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Seeds are treated in a cold plasma in a reaction chamber to etch the surface of the seeds to remove surface materials, such as fungicides and insecticides, or to disinfect the surfaces. The cold plasma process is carried out using etch gases which do not harm the seeds and for selected periods of time sufficient to remove surface materials without necessarily affecting the viability of live seeds after treatment. Tumbling the seeds while exposing the seeds to the plasma allows the surfaces of the seeds to be etched uniformly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.