Cooling element and cooling apparatus using the same
US6543521B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 4, 2000 |
| Grant date | Apr 8, 2003 |
| Priority date | — |
| Expiry date | Oct 4, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The cooling element of the present invention comprises a base section in contact with a heat producing element, and a heat dissipation section integrally formed with the base section. The cooling element of the present invention is constructed such that a ratio of T (a thickness of the base section) to L (a reference length, namely, a shortest width or an external diameter of the base section disposed right above the heat producing element) is within a range of not less than 0.14 and not more than 0.24. The cooling element of the present invention comprises a base section in contact with a heat producing element and a heat dissipation element integrally formed with the base section. The cooling element of the present invention is constructed such that a ratio of d (a length of the base section at around the center) to L2 (a longest length or an external diameter of said base section) is not less than 0.5.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.