Enhanced module kick-out spring mechanism for removable small form factor optical transceivers
US6544055B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 1, 2000 |
| Grant date | Apr 8, 2003 |
| Priority date | — |
| Expiry date | Nov 1, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R13/641
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A spring-to-spring engagement of a kick-out spring and a secondary spring is disposed intermediate a structure supporting an electrical connector and an insertable and latchable electronic module or the like to enhance the disconnection and ejection of the module from the connector to which the module is connected. The spring-to-spring engagement insures both that adequate spring force is stored upon insertion and connection of the module and that disconnection and ejection forces are applied to the module. The forces are applied over a sufficient distance to fully displace the module from its latched position to its position of disconnection from the connectors and still provide spring force travel of the module to eject at least partially the module from the receiver or port into which the module was inserted and connected. A side benefit of the arrangement is that a high force is exerted on the module once it is unlatched for removal, and this high force will displace the module adequately to insure that the latch of the module does not relatch and to prevent removal of the module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.