Method for enhancing the solderability of a surface
US6544397B2 · kind B2 · utility
10Cited by
11References
11Claims
0Family size
Inventors
Key dates
| Filing date | Mar 29, 2001 |
| Grant date | Apr 8, 2003 |
| Priority date | — |
| Expiry date | May 26, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/244
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering, which immersion silver plate is treated with an additive selected from the group consisting of fatty amines, fatty amides, quaternary salts, amphateric salts, resinous amines, resinous amides, fatty acids, resinous acids, ethoxylated derivatives of any of the foregoing, and mixtures of any of the foregoing. The immersion silver deposits created are resistant to electromigration.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.