Methods for detaching a layer from a substrate
US6544430B2 · kind B2 · utility
83Cited by
27References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 31, 2001 |
| Grant date | Apr 8, 2003 |
| Priority date | — |
| Expiry date | May 31, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1158
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Improved methods and articles used to fabricate flexible circuit structures are disclosed. The methods include depositing a release layer or a dielectric film on a substrate, and then forming a conductive laminate on the release layer or the dielectric film. The conductive laminate may be easily separated by the substrate to eventually form a flexible circuit structure. Plasma may be used to treat a surface of the release layer or the dielectric film to produce a plasma-treated surface to lower the peel strength of any film or layer bound to the plasma-treated surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.